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| E2E0008-38-94 Semiconductor Semiconductor MSM5052 GENERAL DESCRIPTION This version: Sep. 1998 MSM5052 Previous version: Mar. 1996 Built-in Temperature Circuit and LCD Driver 4-Bit Microcontroller The MSM5052 is a low-power microcontroller manufactured in complementary metal-oxide semiconductor technology. Integrated into a single chip are ROM, RAM, crystal oscillator, voltage doubler, timer, LCD driver, input port, output port, and thermistor-based temperature measuring circuit. Using an on-chip ROM reduces power consumption. The MSM5052 is widely used in electronic products requiring low-power operation, for example, thermometer and clinical thermometer. FEATURES * Low power consumption * Internal ROM * Internal RAM * I/O port Input port Output port : 1280 14 bits : 62 4 bits : 2 ports 4 bits : 1 port 4 bits 1 port 1 bit * 4 4 key matrix input is available by using K1 to K4 and M1 to M4 * 26 LCD drivers (1/2 duty, 1/2 bias, 52 segments) * 42 instructions * Minimum instruction execution time : 122.1 ms (Display instruction cycle: 244.2 ms) * 1.5 V operating voltage (Built-in LCD drive voltage doubler) * Buzzer function * Built-in thermistor-based temperature measuring circuit * Crystal oscillator : 32.768 kHz * Package options: 56-pin plastic QFP (QFP56-P-910-0.65-K) : (Product name : MSM5052-GS-K) 56-pin plastic QFP (QFP56-P-910-0.65-2K) : (Product name : MSM5052-GS-2K) 80-pin plastic QFP (QFP80-P-1420-0.80-BK): (Product name : MSM5052-GS-BK) Chip (Chip size 4.77 mm 4.36 mm) : (Product name : MSM5052-) indicates a code number. 1/12 Semiconductor BLOCK DIAGRAM DIN0 to DIN3 BD BUZZER DRIVER MPX ACC DOUT0 to DOUT3 DATA RAM 62 4 bits A3 to A0 A6 to A4 MPX OUTPUT PORT OUTPUT PORT (M1-M4) INPUT PORT (K1-K4) INPUT PORT (S1-S4) FMT REGISTER PROGRAM COUNTER DOUT13 to DOUT0 A0 to A10 PROGRAM ROM 1280 14 bits C Z ALU P REGISTER LD M1 to M4 MPX K1 to K4 DISPLAY LATCH and DRIVER SEGMENT OUT 1 to SEGMENT OUT 26 COM 1 COM 2 S1 to S4 MPX INSTRUC -TION DECODER COUNTER XT XT TIMING GENERATOR RC OSCILLATOR OSC OSC OSC OSC TH R C IN VDD VSS1VSS2 VCP VCM RESET T1 T2 T3 T4 T5 MSM5052 2/12 Semiconductor MSM5052 PIN CONFIGURATION (TOP VIEW) 53 COM1 56 SEG3 55 SEG2 54 SEG1 45 VSS2 44 VSS1 49 VDD 43 NC 42 NC 41 OSC TH 40 OSC R 39 OSC IN 38 OSC C 37 K4 36 K3 35 K2 34 K1 33 LD 32 M4 31 M3 30 M2 29 M1 SEG4 SEG6 SEG8 SEG9 SEG10 SEG12 SEG13 SEG14 SEG15 SEG18 SEG20 SEG21 SEG22 SEG23 1 2 3 4 5 6 7 8 9 10 11 12 13 14 SEG24 15 COM2 17 XT 18 NC 19 XT 20 VDD 21 RESET 22 VCP 23 VCM 24 S1 25 46 BD 52 T3 51 T1 50 T2 48 T4 47 T5 S2 26 S3 27 SEG25 16 NC: No-connection pin 56-Pin Plastic QFP Note: SEG5, SEG7, SEG11, SEG16, SEG17, SEG19, and SEG26 are not connected to package pins. S4 28 3/12 Semiconductor MSM5052 PIN CONFIGURATION (TOP VIEW) (continued) 78 COM1 80 SEG2 79 SEG1 66 VSS2 65 VSS1 67 VDD 77 NC 76 NC 75 NC 72 NC 68 BD 74 T3 73 T1 71 T2 70 T4 69 T5 SEG3 SEG4 SEG5 SEG6 SEG7 SEG8 SEG9 SEG10 SEG11 1 2 3 4 5 6 7 8 9 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 NC NC OSC TH NC OSC R NC OSC IN NC OSC C K4 NC K3 K2 NC K1 LD M4 M3 M2 NC M1 NC NC S4 SEG12 10 SEG13 11 NC 12 SEG14 13 SEG15 14 SEG16 15 SEG17 16 SEG18 17 SEG19 18 SEG20 19 SEG21 20 SEG22 21 SEG23 22 SEG24 23 SEG25 24 SEG26 RESET VDD NC NC NC NC VCP COM2 VCM NC XT XT S1 S2 NC: No-connection pin 80-Pin Plastic QFP S3 4/12 Semiconductor MSM5052 PAD CONFIGURATION Pad Layout SEG23 SEG22 SEG21 SEG20 SEG19 SEG18 SEG17 SEG16 SEG15 SEG14 SEG13 SEG12 SEG11 SEG10 SEG9 SEG8 SEG7 SEG6 SEG5 SEG4 SEG24 SEG25 SEG26 COM2 XT NC XT SEG3 SEG2 SEG1 COM1 T3 VDD RESET VCP VCM S1 S2 S3 S4 M1 M2 M3 M4 LD K1 K2 K3 K4 OSC C OSC IN OSC R OSC TH BD VDD VSS2 VSS1 T1 T2 T4 T5 Chip size 4.77 4.36 (mm) 5/12 Semiconductor MSM5052 PIN DESCRIPTIONS Symbol VDD VSS1 VSS2 VCP, VCM XT, XT T1 to T5 RESET BD OSC C, OSC IN Ground. Power source (-1.5 V). Power source for LCD driver (-3.0 V). This pin is connected to the VDD pin through a 0.1 mF capacitor. Booster capacitor connection pins. VCP pin is connected to the VCM pin through a 0.1 mF capacitor. Input and output pins of oscillator inverter. A 32.768 kHz crystal is connected to these pins. Pins to test internal logic. T1, T2, T4, and T5 are pulled down to VSS1. T3 is the output. Test pins are normally open. Pin to clear internal logic, pulled down to VSS1. After power is turned on, the MSM5052 can be reset by this pin. Buzzer output. thermistor, and capacitor connection pins. Description OSC TH, OSC R, Pins to RC oscillation circuit for temperature detection. These are the fundamental resistor, 6/12 Semiconductor MSM5052 ABSOLUTE MAXIMUM RATINGS Parameter Power Supply Voltage Input Voltage Storage Temperature Operating Temperature Symbol VSS1-VDD VIN TSTG Top Condition Ta = 25C Ta = 25C -- -- Rating -2.0 to +0.3 VSS1 - 0.3 to +0.3 -55 to +125 -20 to +75 Unit V V C C ELECTRICAL CHARACTERISTICS DC Characteristics (VDD = 0 V, VSS1 = -1.55 V, VSS2 = -3.0 V, C1 = 30 pF, Ta = 25C) Parameter VSS1 Operating Voltage Power Supply Current 1 Power Supply Current 2 Oscillation Start Voltage Output Current 1 COM Output Current 2 SEGMENT Output Current 3 C, R, TH Output Current 4 M1-M4, LD Output Current 5 BD Input Current S1-S4, K1-K4 Built-in CD Capacitance Symbol VSS1 IDD1 IDD2 VOSC IOH1 IOM1 IOL1 IOH2 IOL2 IOH3 IOL3 IOH4 IOL4 IOH5 IOL5 IIH IIL CD Condition VSS1 pin Temperature sampling off (Refer to measuring circuit) Temperature sampling on (Refer to measuring circuit) Within 10 seconds, VSS1 pin (Refer to measuring circuit) VOH1 = -0.2 V VOM1 = VSS1 0.2 V VOL1 = -2.8 V VOH2 = -0.2 V VOL2 = -2.8 V VOH3 = -0.4 V VOL3 = -1.15 V VOH4 = -0.4 V VOL4 = -1.15 V VOH5 = -0.4 V VOL5 = -1.15 V VIN = 0 V VIN = -1.55 V -- Min. -1.65 -- -- -- -- -4 4 -- 0.4 -- 400 -- 10 -200 3 3 -0.2 -- Typ. -1.55 3.0 *1 100 *2 -- -- -- -- -- -- -- -- -- -- -- -- -- -- 25 Max. -1.25 -- -- -1.45 -4 +4 -- -0.4 -- -400 -- -100 -- -50 -- 30 -- -- mA mA mA mA mA pF mA Unit V mA mA V *1 The typ. value varies depending on the application program. *2 The typ. value varies depending on the application program and RC thermistor to be used. 7/12 Semiconductor Measuring circuit OSC IN OSC C R1 R2 OSC R OSC TH MSM5052 VCP VCM XT XT C1 VDD VSS1 VSS2 C3 A V MSM5052 C4 C2 Crystal 32.768 kHz C1 C2, C3 C4 R1, R2 : 20 pF : 0.1 mF : 3000 pF : 10 kW 8/12 Semiconductor MSM5052 APPLICATION CIRCUIT LCD TH COM2 OSC TH OSC R SEGMENTS COM1 M1 M2 M4 LD HI Alarm output LO Data Serial data Latch R1 R2 C1 OSC IN OSC C MSM5052 XT (CD = 25 pF) XT VCP VCM VSS2 S4 S2 BD VSS1 VDD RESET K2 K3 K1 *1 C2 32.768 kHz C3 Piezo R1 : 33 kW R2 : 20 kW TH : 40BT-5 40 kW 10% at 25C B = 3550 2% C1 C2 C3 C4 : : : : 680 pF 5 to 35 pF 0.1 mF 0.1 mF S1 S4 C4 *2 C/F S2 S1 1 2 3 4 5 *1 Inner switch or pad on PCB *2 Bonding option 1 Thermometer one-second sampling 2 Thermometer 10-second sampling 3 The highest temperature alarm 4 The lowest temperature alarm 5 Clock 9/12 Semiconductor MSM5052 PACKAGE DIMENSIONS (Unit : mm) QFP56-P-910-0.65-K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.36 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 10/12 Semiconductor MSM5052 (Unit : mm) QFP56-P-910-0.65-2K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.43 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 11/12 Semiconductor MSM5052 (Unit : mm) QFP80-P-1420-0.80-BK Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 1.27 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 12/12 |
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